Tetric N-Bond Self-Etch is a light-curing, single-component adhesive for direct and indirect bonding procedures and all etching techniques
- Based on acetone-free chemistry as only water is used as solvent
- It is universally suitable for direct and indirect bonding procedures and all etching protocols
- The dental adhesive has high bond strength (> 25 MPa) on wet and dry dentin
- Due to its integrated desensitizing effect the risk of postoperative sensitivity is minimal
- Together with the integrated nano-fillers the formation of a homogeneous layer and good penetration of the adhesives is possible
- Due to hydrolytically stable monomers Tetric N-Bond Self-Etch can be stored at room temperature
- Tetric N-Bond Self-Etch Refill is available in 6g bottle
- Indications:
- Direct-placed light-curing composite and compomer restorations
- Direct-placed core build-ups with light-, self- and dual-curing composites
- Repair of fractured composite and compomer restorations. Adhesive cementation of indirect restorations with light- and dual-curing luting composites
- Sealing of prepared tooth surfaces before temporary/permanent cementation of indirect resto-rations
- Desensitization of hypersensitive cervical areas